PR3003 MEMS and Nanotechnology Syllabus:
PR3003 MEMS and Nanotechnology Syllabus – Anna University Regulation 2021
COURSE OBJECTIVES:
• To introduce the changes in properties of materials with dimension reduction and materials for MEMS.
• To provide overview of micro fabrication processes applicable for MEMS.
• To introduce students on the working principle of typical micro-sensors, micro-actuators and MEMS devices and the role of packaging.
• To apply knowledge on strength of materials, thermal and design engineering in design of MEMS devices.
• To familiarize the properties and method of synthesis of nonmaterial and progress of MEMS to nano system.
UNIT I EFFECT OF MINIATURISATION AND MATERIALS FOR MEMS
Definition – historical development – fundamentals – Scaling laws in miniaturization – Rigid Body dynamics, Electrostatic Forces, Electromagnetic properties, Electricity, diffusion property, optical property and Heat Transfer, Materials for MEMS and Microsystems – Si, Si compounds, Si Piezo resistors, GaAs, Quartz, Piezoelectric Crystals and Polymers –Doping of semiconductors–diffusion process
UNIT II MICRO-FABRICATION PROCESSES
Photolithography – photo resist applications, light sources and post baking – Ion implantation – diffusion process –oxidation – thermal oxidation, silicon dioxide, oxidation rate, oxide thickness by colour – chemical vapour deposition – enhanced CVD – Physical vapour deposition – sputtering – deposition by epitaxy – etching – chemical and plasma etching. Bulk micro manufacturing – wet etching, dry etching and etch stop – surface micromachining – LIGA process – SLIGA process.
UNIT III MICROSYSTEM–WORKING PRINCIPLE AND PACKAGING
Microsensors–Optical,Pressure,AcousticwaveandThermalsensors–Microactuation–thermal forces, shape memory alloys, piezoelectric crystals and Electrostatic Forces – MEMS with micro actuators – Micro gripper, Micro motor, micro valves and micro pumps – Micro accelerometers – Micro fluidics – micro mirror array for video projection – Micro system packaging – die level, device level and system level – Interfaces – Die preparation – surface bonding- wire bonding – sealing – Assembly of Microsystems–selection of packaging materials –signal mapping and transduction– pressure sensors packaging.
UNIT IV MICROSYSTEMS DESIGN
Static bending of thin plates–Mechanical Vibration–thin film mechanics –Design considerations – constraints, selection of materials, selection of Manufacturing processes, selection of signal transduction, electromechanical system and packaging – Process design – Mechanical Design Thermo mechanical loading, Thermo mechanical stress analysis, Dynamic Analysis and Interfacial fracture Analysis – simulation of Micro fabrication process – Design of a Si die for a micro pressure sensor – Fluid resistance in Micro channels – capillary electrophoresis network systems – Design of MEMS cell gripper – Micro Optical Electro Mechanical System –Complementary Metal Oxide Semiconductor.
UNIT V NANOTECHNOLOGY
Classification of nano structures – effect of the nanometer length scale effects of nano scale dimensions on various properties structural, thermal, chemical, mechanical, magnetic, optical and electronic properties – Fabrication methods – Top-down processes – bottom-up processes – nano positioning systems.
TOTAL: 45 PERIODS
COURSE OUTCOMES:
Upon successful completion of the course, students should be able to:
CO1: Understand the changes in properties of materials with reduction of dimensions by Scaling laws and choice of materials for MEMS.
CO2: Overview of principles of micro fabrication techniques applicable for MEMS.
CO3: Familiarize on typical MEMS sensors, actuators and devices as well as packaging.
CO4: Apply knowledge on strength of materials, design and thermal engineering for development of MEMS.
CO5: Understand on properties and method of synthesis of nanomaterials and their role in nano systems.
TEXT BOOKS
1. Mahalik N P, “MEMS”, McGraw Hill (India), 2017.
2. Tai–Ran Hsu, “MEMS and Microsystems Design and Manufacture”, 1st edition, Tata-McGrawHill, New Delhi, 2017.
REFERENCES
1. Ananthasuresh G.K, Vinoy K. J, Gopalakrishnan. S, Bhat K. N and Aatre V.K., “Micro and smart systems”, Wiley India Pvt. Ltd., New Delhi, 2010.
2. Charles P Poole, Frank J Owens, “Introduction to Nano Technology”, John Wiley and Sons, 2003.
3. Julian W. Hardner, “Micro Sensors, Principles and Applications”, CRC Press, 1994.
4. Marc Madou, Fundamentals of Micro fabrication, CRC Press, New York, 2011.