CEI350 Semiconductor Manufacturing Syllabus:
CEI350 Semiconductor Manufacturing Syllabus – Anna University Regulation 2021
COURSE OBJECTIVES:
1. To understand basic semiconductor manufacturing technology
2. To know Integrated Circuit Fabrication
3. To introduce the basic semiconductor manufacturing processes
4. To familiarize with steps involved in CMOS IC chip fabrication
5. To explain major processing technology used IC manufacturing.
UNIT – I INTRODUCTION TO SEMICONDUCTOR MANUFACTURING
Historical perspective, processing overview, semiconductor materials, semiconductor devices, process technology, fabrication steps.
UNIT -II MANUFACTURING PROCESS: CRYSTAL GROWTH, SILICON OXIDATION, PHOTOLITHOGRAPHY
Silicon crystal growth, material characterization, thermal oxidation process, impurity redistribution, masking properties of silicon dioxide, oxidation thickness characteristics.
UNIT – III MANUFACTURING PROCESS: ETCHING, DIFFUSION, ION IMPLANTATION, FILM DEPOSITION
Wet chemical etching, Dry etching, basic diffusion process, extrinsic diffusion, lateral diffusion, Photolithography, Ion Implantation, implanted damage and annealing, epitaxial growth techniques, structures and defects, dielectric deposition, metallization.
UNIT – IV PROCESS INTEGRATION
Passive components, bipolar technology, MOSFET Technology, MESFET Technology, MEMS Technology.
UNIT – V IC MANUFACTURING
Electrical testing, packing, statistical process control, computer integrated manufacturing, challenges for integration, system-on-a-chip.
TOTAL: 45 PERIODS
SKILL DEVELOPMENT ACTIVITIES (Group Seminar/Mini Project/Assignment/Content Preparation / Quiz/ Surprise Test / Solving GATE questions/ etc)
Interpretation of Data Sheet of transistors and ICs with respect to their Static and Dynamic Characteristics.
Familiarization of any one relevant software tool (MATLAB/ SCILAB/ LABVIEW/ Proteus/ Equivalent open source software)
Design and verification of simple signal conditioning circuit through simulation Realization of signal conditioning circuit in hardware
Introduction to other advanced logic circuits not covered in the above syllabus
COURSE OUTCOMES:
Students able to
CO1 Relate technology changes from semiconductor manufacturing industry.
CO2 Explain steps for making silicon wafers from sand.
CO3 Apply various technology involved in manufacturing.
CO4 Analyze the integration of steps in CMOS IC chip fabrication.
CO5 Build CMOS-based used in the electronics industry.
TEXT BOOKS:
1. G. S. May and S. M. Sze, Fundamentals of Semiconductor Fabrication, Wiley India, 2004.
2. Hong Xiao, Introduction to Semiconductor Manufacturing Technology – Second Edition, SPIE Press, 2012.
REFERENCES:
1. W. R. Runyan and K. E. Bean, Semiconductor Integrated Circuit Processing Technology, Addison Wesley Publishing Company, 1990
2. S. A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press, 1996.
3. M. J. Madou, Fundamentals of Micro fabrication, 2nd Edition, CRC Press, 2011.
4. S. M. Sze, Semiconductor Devices: Physics and Technology, 2nd Ed., Wiley India, 2011