CEI352 Green Electronics Syllabus:

CEI352 Green Electronics Syllabus – Anna University Regulation 2021

COURSE OBJECTIVES:

1. To understand knowledge on the theories and eco-design concepts of green electronics
2. To familiarize with green electronic materials and products
3. To design sustainable green electronic products
4. To gain knowledge on Flip-Chip Assembly Process
5. To address issues on environmental impact; product design, operating life, and the 3R concept (reduce, reuse, and recycle).

UNIT I INTRODUCTION TO GREEN ELECTRONICS

Environmental concerns of the modern society- Overview of electronics industry and their relevant regulations in China, European Union and other key countries- global and regional strategy and policy on green electronics industry. Restriction of Hazardous substances (RoHS) – Waste Electrical and electronic equipment (WEEE – Energy using Product (EuP) and Registration – Evaluation, Authorization and Restriction of Chemical substances (REACH).

UNIT II GREEN ELECTRONICS MATERIALS AND PRODUCTS

Basics of IC manufacturing and its process – Electronics with Lead (Pb) -free solder pastes, conductive adhesives, Introduction to green electronic materials and products – halogen-free substrates and components. Substitution of non-recyclable thermosetting polymer based composites with recyclable materials X-Ray Fluorescence (XRF) for identifying hazardous substances in electronic products.

UNIT III GREEN ELECTRONICS ASSEMBLY AND RECYCLING

Various processes in assembling electronics components – the life-cycle environmental impacts of the materials used in the processes – substrate interconnects. Components and process equipments used. Technology and management on e-waste recycle system construction, global collaboration, and product disassembles technology.

UNIT IV FLIP-CHIP ASSEMBLY AND BONDING FOR LEAD-FREE ELECTRONICS

Flip-Chip Assembly Process – Placement and Under fill stage-FEM of Die stress – Gold stud Bump Bonding – Materials and Process Variations – Integrating Flip Chip into a Standard SMT Lead-Free Reflow soldering Techniques and Analytical Methods – Electro migration Analysis for Mean-Time-toFailure Calculations – Gold-Tin Solder Integrating Vertical-Cavity Surface Emitting Lasers onto Integrated Circuits – Design and Processing of Flip-Chip Bonding Structures – Opto-Electronic Integration.

UNIT V CASE STUDIES

Lead-Free Electronic Design – Selection of the Package Type – Substrate or Die Attachment FR4 – Electrical Connections from Die to FR4 – Assess Impact of CTE Mismatch on Stress and Fatigue Life – Design Solder Balls for External Connection to PCB – Thermal Analysis of Flip-Chip Packaging – RLC for Flip-Chip Packages – Drop Test of Flip-Chip Packaging – Wei bull Distribution for Life Testing and Analysis of Test Data.

TOTAL: 45 PERIODS

SKILL DEVELOPMENT ACTIVITIES (Group Seminar/Mini Project/Assignment/Content Preparation / Quiz/ Surprise Test / Solving GATE questions/ etc)

1 Interpretation of Data Sheet of electronics with respect to their Static and Dynamic Characteristics.
2 Selection of green electronics for product design.
3 Familiarization of any one relevant software tool (MATLAB/ SCILAB/ LABVIEW/ Proteus/ Equivalent open source software)
4 Design and verification of simple signal conditioning circuit thro simulation.
5. Realization of signal conditioning circuit in hardware
6. Introduction to other advanced green electronics not covered in the above syllabus

COURSE OUTCOMES:

CO1 Relate theories, eco-design concepts and methods of green electronics
CO2 Explain the various materials used in green electronic products
CO3 Apply technology related to e-waste recycle system
CO4 Analyze eco-design processes involved in electronic industry.
CO5 Build environment friendly electronic manufacturing systems.

REFERENCES:

1. Lee Goldberg, “Green Electronics/Green Bottom Line, Newnes Publications 2000
2. Green Communications and Networks, by Yuhang yang and Maode Ma, Springer Publication.