CMR356 Micro Electro Mechanical Systems Syllabus:

CMR356 Micro Electro Mechanical Systems Syllabus – Anna University Regulation 2021

COURSE OBJECTIVES:

1. To provide knowledge of semiconductors and solid mechanics to fabricate MEMS devices.
2. To educate on the rudiments of Micro fabrication techniques.
3. To introduce various sensors and actuators
4. To introduce different materials used for MEMS
5. To educate on the applications of MEMS to disciplines beyond Electrical and Mechanical engineering.

UNIT – I INTRODUCTION

Intrinsic Characteristics of MEMS – Energy Domains and Transducers- Sensors and Actuators – Introduction to Micro fabrication – Silicon based MEMS processes – New Materials – Review of Electrical and Mechanical concepts in MEMS – Semiconductor devices –Polymers in MEMS– Polyamide – SU-8 – Liquid Crystal Polymer (LCP) – PDMS – PMMA – Parylene – Fluorocarbon.

UNIT – II SENSORS

Characteristics of sensors – Electrostatic sensors – Parallel plate capacitors – Piezoresistive sensors – Piezoresistive sensor materials – Stress and strain analysis – Flexural beam bending – Torsional deflection– Applications to Inertia, Pressure, Tactile and Flow sensors – Piezoelectric sensors and actuators – piezoelectric effects – piezoelectric materials

UNIT – III ACTUATORS

Applications – Interdigitated Finger capacitor – Comb drive devices – Micro Grippers – Micro Motors – Thermal Sensing and Actuation – Thermal expansion – Thermal couples – Thermal resistors – Thermal Bimorph – Applications –Magnetic Actuators – Micromagnetic components – Case studies of MEMS in magnetic actuators -Actuation using Shape Memory Alloys

UNIT – IV MICROMACHINING

Silicon Anisotropic Etching – Anisotropic Wet Etching – Dry Etching of Silicon – Plasma Etching– Deep Reaction Ion Etching (DRIE) – Isotropic Wet Etching – Gas Phase Etchants – Case studies – Basic surface micro machining processes – Structural and Sacrificial Materials – Acceleration of sacrificial Etch – Striction and Antirestriction methods – LIGA Process – Assembly of 3D MEMS – Foundry process

UNIT – V APPLICATIONS OF MEMS INERTIAL SENSORS

Application to Acceleration, Inertia, Acoustic, Tactile, Pressure, Flow and Tactile sensorsOptical MEMS –Lenses and Mirrors -Actuators for Active Optical MEMS.– RF MEMS and Microfluidics.

TOTAL: 45 PERIODS

COURSE OUTCOMES

Upon successful completion of the course, students should be able to:
CO 1: Recognize MEMS Energy Domains and Transducers, Sensors and Actuators.
CO 2: Select the Various MEMS sensors and its Stress and strain
CO 3: Apply various MEMS actuators in Real time system.
CO 4: Demonstrate various micro machining processes, Structural and Sacrificial Materials
CO5: Analyze the various MEMS inertial, tactile, pressure and flow sensors in real time system

TEXT BOOKS:

1. Chang Liu, “Foundations of MEMS”, Pearson Education Inc., 2014, 2ndedition .
2. Stephen D Senturia, “Microsystem Design”, Springer Publication, 2001.
3. Tai Ran Hsu, “MEMS & Micro systems Design and Manufacture” Tata McGraw Hill, New Delhi, 2008.

REFERENCES:

1. James J.Allen, “Micro Electro Mechanical System Design”, CRC Press Publisher, 2010
2. Julian w. Gardner, Vijay K. Varadan, Osama O. Awadelkarim, “Micro Sensors MEMS and Smart Devices”, John Wiley & Son LTD,2002
3. Mohamed Gad-el-Hak, editor, “ The MEMS Handbook”, CRC press Baco Raton, 2000
4. Nadim Maluf,“ An Introduction to Micro Electro Mechanical System Design”, Artech House, 2000.
5. Thomas M.Adams and Richard A.Layton, “Introduction MEMS, Fabrication and Application,” Springer 201