CMR350 Electronics Manufacturing Technology Syllabus:
CMR350 Electronics Manufacturing Technology Syllabus – Anna University Regulation 2021
COURSE OBJECTIVES:
• To impart knowledge on wafer preparation and PCB fabrication
• To introduce Through Hole Technology (THT) and Surface Mount Technology (SMT) with various types of electronic components
• To elaborate various steps in Surface Mount Technology (SMT)
• To be acquainted with various testing and inspection methods of populated PCBS
• To outline repair, rework and quality aspects of Electronic assemblies.
UNIT I INTRODUCTION TO ELECTRONICS MANUFACTURING
History, definition, wafer preparation by growing, machining, and polishing, diffusion, microlithography, etching and cleaning, Printed circuit board –fabrication, types, single sided, double sided, multi-layer and flexible printed circuit board
UNIT II COMPONENTS AND PACKAGING
Introduction to packaging, types-Through hole technology(THT) and Surface mount technology (SMT), Through hole components – axial, radial, multi leaded, odd form Surface-mount components- active, passive. Interconnections – chip to lead interconnection, die bonding, wire bonding, TAB, flip chip, chip on board, multi chip module, direct chip array module, leaded, leadless, area array and embedded packaging, miniaturization and trends.
UNIT III SURFACE MOUNT TECHNOLOGY
SMT Process, SMT equipment and material handling systems, handling of components and assemblies – moisture sensitivity and ESD, safety and precautions needed, IPC and other standards, stencil printing process – solder paste material, storage and handling, stencils and squeegees, process parameters, quality control. Component placement- equipment type, flexibility, accuracy of placement, throughput, packaging of components for automated assembly, soldering- wave soldering, reflow process, process parameters, profile generation and control, adhesive, underfill and encapsulation process
UNIT IV INSPECTION AND TESTING
Inspection techniques, equipment and principle- AOI, X-ray. Defects and Corrective action – stencil printing process, component placement process, reflow soldering process, electrical testing of PCB assemblies- In circuit test, functional testing, fixtures and jigs.
UNIT V REPAIR, REWORK, QUALITY AND RELIABILITY OF ELECTRONICS ASSEMBLIES
Repair and rework of PCB- Coating removal, base board repair, conductor repair, thermo mechanical effects and thermal management, Reliability fundamentals, reliability testing, failure analysis, design for manufacturability, assembly, reworkability, testing, reliability, and environment.
TOTAL: 45 PERIODS
COURSE OUTCOMES:
At the end of this course, the students should be able to:
CO1: Perceive wafer preparation and PCB fabrication
CO2: Recognize the importance of Through Hole Technology (THT) and Surface Mount Technology (SMT)
CO3: Demonstrate various steps in Surface Mount Technology (SMT)
CO4: Identify various testing and inspection methods of populated PCBS
CO5: Discuss various techniques in repair, rework, quality and reliability of electronics Assemblies
TEXT BOOKS:
1. Prasad R., “Surface Mount Technology – Principles and practice”,2nd Edition, Chapman and Hall., New York, 1997, ISBN 0-41-12921-3.
2. Tummala R.R., “Fundamentals of microsystem packaging”, Tata McGraw Hill Co. Ltd., New Delhi, 2001, ISBN 00-71-37169-9.
REFERENCES:
1. Harper C.A., “Electronic Packaging and Interconnection Handbook” 2nd Edition, McGraw Hill Inc., New York, N.Y., 1997, ISBN 0-07-026694-8.
2. Lee N.C., “Reflow Soldering Process and Trouble Shooting SMT, BGA, CSP and Flip Chip Technologies”, Elsevier Science. United Kingdom, 2001.
3. Puligandla Viswanadham and Pratap Singh., “Failure Modes and Mechanisms in Electronic Packages”, Chapman and Hall., New York, 1997, N.Y. ISBN 0-412-105591-8. Science and Technology, United Kingdom, 1997, ISBN 0750698756.
4. Totta P., Puttlitz K. and Stalter K., “Area Array Interconnection Handbook”, Kluwer Academic Publishers, Norwell, MA, United States, 2001, ISBN 0-7923-7919-5.
5. Zarrow P. and Kopp D., “Surface Mount Technology Terms and Concepts”, Elsevier, 1997.